Enforcement of the United States-Japan semiconductor agreement : report (to accompany H. Res. 146).
1989
P C762
Formats
Format | |
---|---|
BibTeX | |
MARCXML | |
TextMARC | |
MARC | |
DublinCore | |
EndNote | |
NLM | |
RefWorks | |
RIS |
Details
Corporate Author
Title
Enforcement of the United States-Japan semiconductor agreement : report (to accompany H. Res. 146).
Published
[Washington, D.C.?] : [U.S. G.P.O.], [1989]
Call Number
P C762
Description
3 pages ; 24 cm.
System Control No.
(OCoLC)20255637
GPO Item No.
1008-C
1008-D (MF)
1008-D (MF)
Note
Caption title.
Distributed to some depository libraries in microfiche.
Shipping list number: 89-364-P.
"May 24, 1989."
Distributed to some depository libraries in microfiche.
Shipping list number: 89-364-P.
"May 24, 1989."
Record Appears in
Government Document Classification Number
Y 1.1/8:101-66
Sub-location
/For holdings information see record for: United States congressional serial set [ANALYZED]/